高分辨非制冷相機高分辨非制冷紅外相機具有*的成像質量，高溫度分辨率（0.05oC）以及準確的溫度分析功能
高分辨非制冷相機
高分辨非制冷紅外相機具有*的成像質量，高溫度分辨率（0.05oC）以及準確的溫度分析功能。這款高性能的帶有Cameralink或Gige接口。
該熱成像相機全幀頻50Hz（640×480），與工業(yè)標準Cameralink相配合，適合高速成像。并且，開窗模式下幀頻更高。
應用： 優(yōu)勢:
半導體檢測 高靈敏度
NDT：熱像圖 高分辨率
農作物分析 結構緊湊
精確溫度測量 接口兼容
質量控制 全幀頻高
實時過程控制
熱成像相機指標參數：
Array type | Uncooled micro (a-Si) |
# pixels | 640 (W) x 480 (H) |
Pixel pitch | 17 μm |
Spectral band | 8 μm to 14 μm |
NETD | 55 mK @ 30°C with F/1 lens |
Array cooling | Uncooled |
Pixel operability | > 99.5%* |
Lens | |
Focal length | Various lenses available |
Optical interface | Lens mount supporting multiple lenses |
Imaging performance | |
Frame rate (full frame) | 50 Hz |
Window of interest | Minimum size 160 x 120 (shuttered) |
Temperature stabilization | No ThermoElectric Cooling required (TEC-less) |
Integration type | Rolling shutter |
On-board image processing | NUC (Non-Uniformity Correction) Auto-offset and auto-gain with selectable region of interest XIE (Image Enhancement) Histogram equalization |
On-board functionality | Self-starting, trigger possibilities, BIST (Build-In Self-Test), lifetime and power-on counter, test-pattern |
A to D conversion resolution | 16 bit |
Interfaces | |
Camera control | CameraLink: XSP |
Image acquisition | CameraLink |
Trigger | In or out (configurable) |
Power requirements | |
Power consumption | < 2=""> |
Power supply | 12 V DC |
Physical characteristics | |
Shock | 40 g, 11 ms according to MIL-STD810G |
Vibration | 5 g (20 Hz to 2000 Hz) according to MIL-STD883J |
Ambient operating temperature | - 40 °C to 60 °C (industrial components) |
Storage temperature | - 45 °C to 85 °C (industrial components) |
Dimensions | 49 W x 49 H x 61.35 L mm3 (lens not included) |
Weight camera head | 208 g (lens not included) |
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